BS EN 60068-2-58-2004 环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法
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【英文标准名称】:Environmentaltesting-Tests-TestTd-Testmethodsforsolderability,resistancetodissolutionofmetallizationandtosolderingheatofsurfacemountingdevices(SMD)
【原文标准名称】:环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法
【标准号】:BSEN60068-2-58-2004
【标准状态】:现行
【国别】:英国
【发布日期】:2004-11-19
【实施或试行日期】:2004-11-19
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:铜焊;组件;定义;定义(术语);溶解;电气器具;电气设备;电气元件;电气工程;电子工程;电子设备及元件;环境测试;架设(施工作业);热浸涂敷;喷镀金属;表面安装设备;软钎焊性;软钎焊性试验;软钎焊;金属熔化槽方法;焊接热;耐钎焊温度;钎焊;材料强度;表面安装装置;试验;测试条件;热稳定性
【英文主题词】:Brazing;Components;Definition;Definitions;Dissolution;Electricappliances;Electricalappliances;Electricalcomponents;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Erecting(constructionoperation);Hotdipcoating;Metallization;SMD;Solderability;Solderabilitytesting;Soldering;Solderingbathmethod;Solderingheat;Solderingtemperatureresistance;Solderings;Strengthofmaterials;Surfacemountingdevices;Testing;Testingconditions;Thermalstability
【摘要】:ThispartofIEC60068outlinestestTd,applicabletosurfacemountingdevices(SMD),whichareintendedtomountonsubstrates.Thisstandardprovidesthestandardproceduresforsolderalloyscontaininglead(Pb)andforlead-freesolderalloys.Thisstandardprovidesstandardproceduresfordeterminingthesolderabilityandresistanceofsolderingheattolead-freesolderalloys.Thisstandardprovidesstandardproceduresfordeterminingthesolderability,dissolutionofmetallization(seeB.3.3)andresistanceofsolderingheattosolderalloyswhichareeutecticorneareutectictinleadsolders.Theproceduresinthisstandardincludethesolderbathmethodandreflowmethod.ThesolderbathmethodisapplicabletotheSMDdesignedforflowsolderingandtheSMDdesignedforreflowsolderingwhenthesolderbath(dipping)methodisappropriate.ThereflowmethodisapplicabletotheSMDdesignedforreflowsoldering,todeterminethesuitabilityofSMDforreflowsolderingandwhenthesolderbath(dipping)methodisnotappropriate.TheobjectiveofthisstandardistoensurethatcomponentleadorterminationsolderabilitymeetstheapplicablesolderjointrequirementsofIEC61191-2usingeachofthesolderingmethodsspecifiedinIEC61760-1.Inaddition,testmethodsareprovidedtoensurethatthecomponentbodycanresistagainsttheheatloadtowhichitisexposedduringsoldering.
【中国标准分类号】:K04;L04
【国际标准分类号】:19_040
【页数】:30P;A4
【正文语种】:英语
【原文标准名称】:环境试验.试验.试验Td.表面安装设备(SMD)的可焊性,耐金属化溶融和耐焊接热试验方法
【标准号】:BSEN60068-2-58-2004
【标准状态】:现行
【国别】:英国
【发布日期】:2004-11-19
【实施或试行日期】:2004-11-19
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:铜焊;组件;定义;定义(术语);溶解;电气器具;电气设备;电气元件;电气工程;电子工程;电子设备及元件;环境测试;架设(施工作业);热浸涂敷;喷镀金属;表面安装设备;软钎焊性;软钎焊性试验;软钎焊;金属熔化槽方法;焊接热;耐钎焊温度;钎焊;材料强度;表面安装装置;试验;测试条件;热稳定性
【英文主题词】:Brazing;Components;Definition;Definitions;Dissolution;Electricappliances;Electricalappliances;Electricalcomponents;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Erecting(constructionoperation);Hotdipcoating;Metallization;SMD;Solderability;Solderabilitytesting;Soldering;Solderingbathmethod;Solderingheat;Solderingtemperatureresistance;Solderings;Strengthofmaterials;Surfacemountingdevices;Testing;Testingconditions;Thermalstability
【摘要】:ThispartofIEC60068outlinestestTd,applicabletosurfacemountingdevices(SMD),whichareintendedtomountonsubstrates.Thisstandardprovidesthestandardproceduresforsolderalloyscontaininglead(Pb)andforlead-freesolderalloys.Thisstandardprovidesstandardproceduresfordeterminingthesolderabilityandresistanceofsolderingheattolead-freesolderalloys.Thisstandardprovidesstandardproceduresfordeterminingthesolderability,dissolutionofmetallization(seeB.3.3)andresistanceofsolderingheattosolderalloyswhichareeutecticorneareutectictinleadsolders.Theproceduresinthisstandardincludethesolderbathmethodandreflowmethod.ThesolderbathmethodisapplicabletotheSMDdesignedforflowsolderingandtheSMDdesignedforreflowsolderingwhenthesolderbath(dipping)methodisappropriate.ThereflowmethodisapplicabletotheSMDdesignedforreflowsoldering,todeterminethesuitabilityofSMDforreflowsolderingandwhenthesolderbath(dipping)methodisnotappropriate.TheobjectiveofthisstandardistoensurethatcomponentleadorterminationsolderabilitymeetstheapplicablesolderjointrequirementsofIEC61191-2usingeachofthesolderingmethodsspecifiedinIEC61760-1.Inaddition,testmethodsareprovidedtoensurethatthecomponentbodycanresistagainsttheheatloadtowhichitisexposedduringsoldering.
【中国标准分类号】:K04;L04
【国际标准分类号】:19_040
【页数】:30P;A4
【正文语种】:英语
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